Special Purpose Adhesive Formulation (1)

Polyimide 7#

Component dosage /g component dosage /g
M-phenylenediamine 49 4,4 Diaminodiphenylmethane 49
3,3,4,4 benzophenone tetracarboxylic dianhydride 98 p-aminoacetanilide 2

Preparation and curing Same as polyimide 4#.

Use The glue is used for metal bonding at high temperatures.

Polyimide glue 8#

Component dosage /g component dosage /g
M-phenylenediamine 90 P-aminoacetanilide 4
3,3,4,4 benzophenone tetracarboxylic dianhydride 100 2,4 diaminoacetanilide 6

Preparation and curing Same as polyimide 4#.

Use This glue is mainly used for bonding stainless steel.

Polyimide 9#

Component dosage /g component dosage /g
3,3 diaminodiphenylmethane 1 3,3,4,4 dibenzophenone tetracarboxylic dianhydride 1

Preparation and curing
The resin is first dissolved in N-methylpyrrolidone or diethylene glycol dimethyl ether to form a 25%-30% solution. After gluing, curing at 200°C for 30 minutes, curing at 250°C for 1 hour, curing at 288°C for 30 minutes, and curing pressure 0.35-1.4 MPa.

Use This glue is mainly used for bonding stainless steel.

Polyimide glue 10#

Component dosage /g component dosage /g
3,3,4,4 Diphenyl ether dianhydride 1 4,4 Diaminodiphenylmethane 1
3,3 diaminodiphenylmethane 1

Preparation and curing The above components were made into resin by polyimide 4# process and coated on glass cloth. Heated at 100°C for 1 hour and then sandwiched between stainless steel plates. After heating at 145°C, 200°C, 250°C and 300°C, respectively, for 15 minutes, they were completely cured.

Use The glue is mainly used for metal bonding used at high temperatures.

Polyimide 11#

Component dosage /g component dosage /g
3,3 diaminobenzophenone 1 4,4 diaminobenzophenone 1
3,3,4,4 Benzophenone dianhydride 1

Prepare and cure at 100°C for 1 hour, 120°C for 1 hour, 150°C for 5 hours, and 170°C for 15 hours.

Use The glue is mainly used for metal bonding under high temperature conditions.

Polyimide 12#

Components

The glue is a kind of polyamine imine glue made from dimethylacetamide and dimethylacetamide. The glue content is 16%.

Preparation and curing
The glass impregnated with this glue is baked at 100° C. for 40 minutes. After the second coating, it is heated at 100° C. for 15 minutes. Finally, it is cured at a pressure of 0.1-0.3 MPa, cured at 200° C. for 1 hour, and cured at 280° C. for 2 hours. Completely cured.

Use The glue is resistant to medium, water, oil, seawater, and radiation. Mainly used in -60-280 °C, bonding aluminum alloys, titanium alloys, stainless steel and ceramics.

Source: 21st Century Fine Chemicals Network