Methods for applying ink to etched plates (steel plates): There are many ways to apply ink to etched plates. The ink is first sprayed on the etched board, and then excess ink is scraped off with a retractable squeegee. At this time, the solvent in the ink remaining in the etched area evaporates and forms a gel-like surface, and the rear glue head descends onto the etching plate and sucks the ink.
Ink absorption and printing products: After the rubber head sucks up most of the ink on the etching board, it rises. At this time, this layer of ink volatilizes again. The remaining ink surface of a part is more conducive to the closeness of the printed object and the plastic head. Combine. The shape of the plastic head should be able to produce a rolling action to eliminate excess air from etching the surface of the plate and the ink.
In the production process, the ideal combination of ink and plastic head is that all the ink on the etched board is completely transferred to the object to be printed. During the production process, ink adhesion close to 10 μm or 0.01 mm is transferred to On the substrate, the print head is easily affected by air, temperature, and static electricity. If the evaporation rate and the dissolution rate are controlled in equilibrium from the etching of the plate to the transfer of the plastic head to the substrate, the printing is successful. If evaporated too quickly, the ink will have dried before it is absorbed. If the evaporation is too slow, the surface of the ink is not yet gelatinous and it is not easy to attach the rubber head to the substrate.
Ink absorption and printing products: After the rubber head sucks up most of the ink on the etching board, it rises. At this time, this layer of ink volatilizes again. The remaining ink surface of a part is more conducive to the closeness of the printed object and the plastic head. Combine. The shape of the plastic head should be able to produce a rolling action to eliminate excess air from etching the surface of the plate and the ink.
In the production process, the ideal combination of ink and plastic head is that all the ink on the etched board is completely transferred to the object to be printed. During the production process, ink adhesion close to 10 μm or 0.01 mm is transferred to On the substrate, the print head is easily affected by air, temperature, and static electricity. If the evaporation rate and the dissolution rate are controlled in equilibrium from the etching of the plate to the transfer of the plastic head to the substrate, the printing is successful. If evaporated too quickly, the ink will have dried before it is absorbed. If the evaporation is too slow, the surface of the ink is not yet gelatinous and it is not easy to attach the rubber head to the substrate.
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